Intel is reportedly reworking one of its most advanced chipmaking technologies, and the goal is to close the gap with industry leader TSMC.
According to a report from finance.biggo.com, surfaced via Google News, Intel's 1.4nm manufacturing process is shifting to a design approach called dual-side power delivery. The report says Intel is aiming for mass production of the 1.4nm process in 2029, positioning the move as an effort to catch TSMC.
A quick translation for non-engineers: the "nm" (nanometer) figure is industry shorthand for a chip generation, and smaller numbers generally signal newer, denser, and more efficient chips. "Power delivery" refers to how electricity is routed to the billions of transistors on a chip. Traditionally, power and data signals share the same side of the chip, which can create congestion. Feeding power from a different side is meant to ease that bottleneck and improve performance and efficiency.
The finance.biggo.com report frames this as a competitive play. TSMC, the Taiwanese company that manufactures chips for many of the world's biggest technology firms, is the benchmark Intel is chasing. By 2029, Intel hopes its 1.4nm process, combined with the new power design, will help it keep pace.
It is worth noting the details here are described as reported, not officially confirmed in the source provided, and 2029 is several years out in an industry where roadmaps often shift.
Why it matters: the race to build the most advanced chips shapes the future of everything from smartphones to artificial intelligence, and Intel's roadmap signals whether it can remain a serious rival to TSMC at the cutting edge.